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13 mo agofound 7 d ago

Principal Technologist

Assembly·US > Idaho > Boise·via greenhouse
What the posting is about

Lead advanced packaging technology engagement for key customers. Maintain and improve module processes. Define and drive NPI program schedules. Develop team members and build cross-functional relationships.

Read out of the posting
LevelNot stated
Experience asked12+ years
EmploymentFull time
LocationUS > Idaho > Boise
RemoteNot stated
Visa sponsorshipNot stated
SalaryNot published, and most postings do not
Posted2025-08-22
Found viagreenhouse, direct from their system

We saw it 13 months after it went up.

The posting, as the company wrote it
Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Job Responsibilities Lead advanced packaging technology engagement for key customer new products/applications penetration. To maintain sustain application position with customer R&D and HVM teams (Ensure HVM feedback is accounted for in future defense of process wins). Drive module process and equipment fundamental improvements to ensure we meet customer needs and win applications. Define overall NPI program schedules, align on, and drive required execution plans and program deliverables to completion while meeting critical milestones (customer’s roadmap) Proactively identify talent and continuously develop team members with a deliberate roadmap. Develop metrics to measure NPI program performance and to drive improvement through successive product introduction. Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience. Education & Experience: Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field. 15+ years(bachelor) or 12+years(M.S./Dr.) of experience in the semiconductor field, especially in Thin Film/PECVD/LPCVD/ALD module process development. Tool vendor experience is plus. Strong project management and analytical skills. Proven success in building collaborative partnerships with customers and internal organizations. Effective English oral and written communication skills. Strong leadership qualities to exercise influence both throughout the organization and with BU/Service Team. Goal and customer oriented. Positive and energetic attitude with strong work ethic and initiative. Apply today to be part of what’s next. We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect. To learn more about ASM, find us at asm.com and on LinkedIn , Facebook , Instagram, X and YouTube . ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Copied from Assembly’s own board, not rewritten. Original ↗

Also open at Assembly

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