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Semiconductor Package Electrical Design Engineer
Posted by Renesas on 16 October 2026. Still on their SmartRecruiters board when we checked 30 min ago. Half of Renesas's roles come down within 19 days.
What the posting is about
Lead semiconductor package design, optimize product cost and performance. Design package substrates and PCBs for high-speed memory interfaces and serial communication circuits. Propose and develop design technologies for next-generation products. Grow into a leadership role within the design team.
Read out of the posting
Levelmid
Experience asked3+ years
EmploymentFull time
LocationKodaira, Japan
RemoteNot stated
Visa sponsorshipNot stated
SalaryNot published, and most postings do not
Posted2026-10-16
Found viasmartrecruiters, direct from their system
We had it within the hour it went up.
The posting, as the company wrote it
Employment: Full-time
Experience level: Mid-Senior Level
Job Description
• Lead semiconductor package design in collaboration with IC design engineers to optimize product cost and performance.
• Lead the layout design of package substrates and printed circuit boards for reference designs for semiconductor products incorporating high-speed memory interfaces and high-speed serial communication circuits.
• Investigate technology trends in semiconductor packages and printed circuit boards, and propose and develop design technologies required for next-generation products.
• Take on a leadership role within the design team as your experience grows.
Qualifications
【MUST】
• Ability to understand the Renesas Culture principles of Transparent, Agile, Global, Innovative, and Entrepreneurial, and act in accordance with these values
• At least three years of practical experience in semiconductor package design
• At least three years of practical experience in high-speed or high-frequency electrical design
【WANT】
• At least three years of practical experience in semiconductor package design at a semiconductor manufacturer
• At least three years of experience using electromagnetic field simulation tools such as HFSS and Q3D
• At least three years of experience using high-frequency circuit simulation tools such as ADS and HSPICE
• At least three years of experience in electrical characterization using VNAs, impedance analyzers, or similar equipment, or in EMC evaluation
Additional Information
ルネサスは、「To Make Our Lives Easier(人々の暮らしをより豊かで快適にする)」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。 
 
ルネサスでは、「TAGIE(Transparent、Agile、Global、Innovative、Entrepreneurial)」を企業文化の中核としています。TAGIEは、私たちの働き方や成長のあり方、そしてPurposeの実現に向けた取り組みを支える共通の価値観です。この協調的な精神と挑戦するマインドセットが、半導体技術を通じた産業の変革と、世界中の人々の暮らしへの貢献を可能にしています。 
 
私たちは、競争力のある報酬制度に加え、充実した福利厚生をご用意しています。福利厚生の詳細については、選考プロセスの中でご案内いたします。 
 
私たちとともに未来を創造する挑戦に、ぜひ参加しませんか。皆さまからのご応募をお待ちしております。 
Copied from Renesas’s own board, not rewritten. Original ↗
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